ShenBei Group (HK) Limited -

ShenBei Group (HK) Limited

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multilayer pcbs with gold finger
Specification: MOQ: 1pc Layers: 8L Material: FR-4 TG180 Surface: ENIG+ gold fin
Detail: MOQ: 1pc Layers: 8L Material: FR-4 TG180 Surface: ENIG+ gold finger 30U" Soldermask: green PCB thickness: 1.6mm Min hole size: 0.15mm Minimum line width/***ce: 3/3m

nelco pcbs
Specification: Base material: FR4, FR1, CEM3, aluminum, TG150,TG170,94V0 Copper
Detail: Base material: FR4, FR1, CEM3, aluminum, TG150,TG170,94V0 Copper thickness: 1~4oz Board thickness: 0.5~3.2mm Min. hole size: 0.15mm Min. line width: 0.08mm Min. line ***cing: 0.08mm Surface finishing: HASL, lead free HAS...

smt/dip pcb circuit assembly
Specification: Metal Coating:Copper,Tin, Gold, Silver,etc Mode of Produ
Detail: Metal Coating:Copper,Tin, Gold, Silver,etc Mode of Production:SMT,DIP Layers:Single,Double, Multi Base Material:Fr-1,Fr-2,Fr-3,Fr-4,Fr-5,Cem-4,etc Certification:RoHS, CCC, ISO, SGS

industrial control pcb assembly
Specification: 988PCBA offers turnkey PCB assembly services in prototype and lo
Detail: 988PCBA offers turnkey PCB assembly services in prototype and low production volumes We handle the whole process including: purchasing all the parts (PCBs and components), inventory control, PCB assembly, function testing a...

3 layers rigid flex immersion sliver pcb
Specification: Material: FR-4+PI Layers(R+F):2R+1F layers Thickness:1.2mm Mi
Detail: Material: FR-4+PI Layers(R+F):2R+1F layers Thickness:1.2mm Min holes:0.4 mm Min line/***ce:6 / 6mil Impedance: No Surface treatment:Immersion sliver+ plated gold30U¡±

8 layer rigid-flex board
Specification: Layer count: 8 layer Material: FR4 TG170 + PI Finishing thickne
Detail: Layer count: 8 layer Material: FR4 TG170 + PI Finishing thickness: 1.6mm Copper thickness: 1oz/1oz

4 layer rigid-flex pcb
Specification: 4-layer rigid-flex board PCB Materials: FR-4+ polyamide Thicknes
Detail: 4-layer rigid-flex board PCB Materials: FR-4+ polyamide Thickness: 2.0mm ¡À10% Surface processing: Immersion gold


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